Engr Sr, Package Development (NPI Singulation Engineer)
Job Description
Job Summary:
RESPONSIBILITIES
Requirements:
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
About The Team
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
Job Summary:
- End of Line: Singulation / Trim and From process development.
- Key person responsible to align processes between R&D and Manufacturing.
- Establish process POR through set up, feasibility and characterization followed by package development procedure.
RESPONSIBILITIES
- End of Line process development and enabling technology for molded package.
- Capable to understand singulation design and proposal for improvement from End of Line process.
- Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA.
- Familiar with EMC materials.
- Capability to define KPIV from failures modes.
- Capability to define KPOV and generate output by analyzing process capability.
- Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab).
- Effectively working with technical leaders to generate process deliverables (Control Plan, D/PMEA, etc.).
- Technical Leadership on End of Line Process.
- Capable to initiate new process and equipment working with technical leader and supplier.
- Responsible for P.O spec generation and buy-off.
- Capable to create COO for new process and equipment.
- Capable for benchmarking on the new and better process/equipment which do not exist in company.
- Capability to create End of Line process technology roadmap, especially for molding.
- Capability to generate new design rule based on characterization, working with technical leader and designer.
- Capable to understand customer requirements, application and EHS.
- Capable to find systematic solution and improvement planning for process defects.
- Supporting quality issue during production, effectively working with manufacturing team.
Requirements:
- 2+ years in package development.
- Experienced areas: Discrete department, DSC experience is an advantage.
- Experienced packages: Legacy and New packages
- Degree or Master in any Engineering fields.
- Familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (PowerPoint presentation).
- Personal characteristics: Self-motivated, independent, open mind to communicate, willing to take risk and ability to manage people and task.
About Us
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
About The Team
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.